SABER UCV >
1) Investigación >
Artículos Publicados >

Por favor, use este identificador para citar o enlazar este ítem: http://hdl.handle.net/10872/11557

Título : Interfacial rheological studies of extra-heavy crude oils and asphaltenes: role of the dispersion effect of resins in the adsorption of asphaltenes at the interface of water-in-crude oil emulsionsa
Autor : Acevedo, Sócrates
Escobar, Gastón
Gutiérrez, Luis
Rivas, Hercilio
Gutiérrez, Xiomara
Palabras clave : Adsorption;
asphaltenes;
crude oil emulsions;
dispersion;
rheology.
Fecha de publicación : 21-Jul-2015
Resumen : The interfacial behaviour of a crude oil and an asphaltene system has been studied by a planar rheological method. System S, was a 30% (v/v) xylene dilution of extra-heavy Cerro Negro crude oil; the aqueous phase was tridistilled water or an NaCl solution (2% (w/v)). System S2 was a 3.21% (w/v) dilution of Cerro Negro asphaltene in xylene; aqueous phase as for system S,. These systems were studied under creep in the pH range 1.6-9.5. The elasticity (E, and E,) and viscosity (ttr and qN) surface moduli were obtained from creep compliance measurements. Viscoelastic as well as elastic behaviour was observed. The interfacial rheological behaviour of asphaltene and crude oil systems was found to be very different in the presence and absence of salt. The high values of the moduli, leading to the high stability of water-in-oil emulsions, was attributed to flocculation of asphaltene-resin micelles at the interface. In the absence of resins, asphaltenes were not dispersed and their adsorption at the interface could lead to precipitation and multilayer formation.
URI : http://hdl.handle.net/10872/11557
ISSN : 0927-7757
Aparece en las colecciones: Artículos Publicados

Ficheros en este ítem:

Fichero Descripción Tamaño Formato
acevedo1993.pdf532.92 kBAdobe PDFVisualizar/Abrir

Los ítems de DSpace están protegidos por copyright, con todos los derechos reservados, a menos que se indique lo contrario.

 

Valid XHTML 1.0! DSpace Software Copyright © 2002-2008 MIT and Hewlett-Packard - Comentarios